24L HDI 4-stage

While electronic design continues to improve the performance of the machine, it is also trying to reduce its size. From small mobile phones to small portable products with smart weapons, "small" is the constant pursuit. High-density integration (HDI) technology enables end-product design to be more compact while meeting higher standards of electronic performance and efficiency. HDI is currently widely used in mobile phones, digital (camera) cameras, MP3, MP4, notebook computers, automotive electronics and other digital products, among which mobile phones are the most widely used. HDI boards are generally manufactured using a build-up method. The more times the layers are stacked, the higher the technical grade of the board. The ordinary HDI board is basically one layer, the high-order HDI uses two or more layers of technology, and adopts advanced PCB technology such as stacking holes, plating holes, and laser direct drilling. High-end HDI boards are mainly used in 3G/4G/5H mobile phones, advanced digital video cameras, IC carrier boards, etc.
1. Laser Direct Image Exposure Machine (LDI): The industry's top technology, minimum line width / line spacing 40UM, for graphics transfer of high-precision and high-density products.
2. Laser Drilling: It can meet the minimum hole diameter of 0.05MM and can realize micro-hole processing.
3. Plating Filling: Meets the minimum Dimple 15UM for high density interconnects and any layer interconnect technology.