Quotation for Bare Printed Circuit Boards

1. Gerber Files: Common formats such as RS-274X must include complete production information (e.g., copper layers, drill files, silkscreen layers, solder mask layers).

2. Basic PCB Information: Board material: FR-4, aluminum, copper, or flexible board? Surface finish: HASL (lead or lead-free), ENIG (immersion gold), immersion silver, immersion tin, OSP, etc. Finished copper thickness and board thickness. Solder mask color: green, blue, black, etc. Silkscreen color: white, black, etc.

3. Special Requirements (if any): HDI boards, high-TG materials, flexible board reinforcements, 3M adhesive tape, etc.

Quotation for PCBA (SMT/THT Mounting)

1. Gerber Files: Common formats such as RS-274X must include complete production information (e.g., copper layers, drill files, silkscreen layers, solder mask layers).

2. BOM (Bill of Materials): Detailed list of component models, brands, or specifications.

3. Basic PCB Information: Board material: FR-4, aluminum, copper, or flexible board? Surface finish: HASL (lead or lead-free), ENIG (immersion gold), immersion silver, immersion tin, OSP, etc. Finished copper thickness and board thickness. Solder mask color: green, blue, black, etc. Silkscreen color: white, black, etc.

4. Special Requirements (if any): Programming/Functional testing and debugging/Conformal coating application, etc.

Quotation for Electronic Product Design

1. Project Basic Information:

Product name or purpose: Understand the product's functionality and target market.

Product description: Include main features, application scenarios, target users, etc.

Development goals: Is the focus on rapid prototyping, mass production, or meeting specific certifications (e.g., UL, CE)?

2. Functional Requirements:

Function list: Describe in detail the functions the product must achieve (e.g., supported communication protocols, sensor capabilities, interface types).

Technical specifications: Power consumption, signal range, response time, etc.

Input/output requirements: Voltage, current, connection methods (USB, Bluetooth, Wi-Fi, etc.).

Control methods: Support for buttons, touch screens, remote control, etc.

3. Hardware Requirements:

Size constraints: PCB and enclosure dimensions.

Material requirements: PCB material (e.g., FR-4, high-frequency materials), component grades (industrial, automotive).

Packaging requirements: BGA, QFN, DIP, etc.

Special requirements: Temperature resistance, waterproofing, vibration resistance, etc.

4. Appearance Design:

Enclosure material: Plastic (specific types), metal (aluminum, stainless steel, etc.).

Appearance drawings: 2D or 3D design files (e.g., STEP, IGES).

Color requirements: Surface treatments, painting, plating, etc.

5. Software Requirements:

Embedded software: MCU firmware development, if needed.

Communication protocols: Modbus, CAN, I2C, SPI, etc.

Mobile App or PC software development: Including UI design and functionality.

6. Certifications and Standards:

Compliance requirements: CE, FCC, KC, RoHS, REACH, etc.

Testing requirements: EMC testing, reliability testing, etc.

Production and Service Requirements:

7. Estimated quantity: Samples and mass production quantities.

Budget range: References for design and production costs.

Delivery timeline: Desired milestones (e.g., design completion, sample delivery).

8. Customer Reference Materials:

Similar product references: Existing products with similar functionality or competitors' products.

Prototype design: Provide sketches or initial designs if available.

Circuit schematics or PCB files (if already available).